Radeon IGP 320M Compatible DDR266
(PC2100) SO-DIMM memory Modules
Memory Compatibility Testing:
The objective of the memory compatibility testing program
is to ensure compliance of different memory modules with
the Radeon™ IGP 320M chipset. The modules are tested
as to ATI specifications using industry standard testing
methods. This testing is not intended to replace the normal
OEM module qualification process.
Modules should be submitted to ATI for validation at this
time.
Please contact memory@ati.com should
you have any questions or wish to get your modules validated
on an ATI reference platform.
PDF version
Radeon™ IGP 320M Compatible DDR266 (PC2100) SO-DIMM
memory Modules
| Elpida
|
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 256 MB |
HB54A2568KN-B75B |
2.5 |
8 |
32Mx8 |
Elpida
5425161BTT75B |
| Hynix
|
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 64 MB |
HYMD18M645A6-H |
2.5 |
4 |
8Mx16 |
Hynix
HY5DU281622AT-H |
| 64 MB |
HYMD18M645A6-L |
2 |
4 |
8Mx16 |
Hynix
HY5DU281622AT-L |
| 128 MB |
HYMD116M645A6-H |
2.5 |
8 |
8Mx16 |
Hynix
HY5DU281622AT-H |
| 128 MB |
HYMD216M646A6-H |
2.5 |
4 |
16Mx16 |
Hynix
HY5DU561622AT-H |
| 256 MB |
HYMD232M6466-H |
2.5 |
8 |
16Mx16 |
Hynix
HY5DU561622T-H |
| 256 MB |
HYMD232M646A6-H |
2.5 |
8 |
16Mx16 |
Hynix
HY5DU561622AT-H |
| 512 MB |
HYMD264M646AF8-H |
2.5 |
16 |
32MX8 |
Hynix
HY5DU56822AF-H |
| Micron
|
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 128 MB |
MT8VDDT1664HG-265B1 |
2.5 |
8 |
16Mx8 |
Micron
MT46V16M8 |
| 256 MB |
MT8VDDT3264HDG-265B1 |
2.5 |
8 |
32Mx8 |
Micron
MT46V16M16 |
| Qimonda (formerly
Infineon) |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 256 MB |
HYS64D32001GDL-7 |
2 |
8 |
32Mx8 |
Qimonda
HY25D256800ATL-7 |
| 256 MB |
HYS64D32020GDL-7 |
2 |
8 |
16Mx16 |
Qimonda
HYB25D256160BTL-7 |
| 512 MB |
HYS64D64020GBDL-7 |
2.5 |
8 |
64Mx8 |
Qimonda
HYB25D25600BCL-7 |
| Samsung |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 64 MB |
M470L0914B70-CA2 |
2 |
4 |
8Mx16 |
Sansung
K4H281638B-TCA2 |
| 64 MB |
M470L0914DT0-CB0 |
2.5 |
4 |
8Mx16 |
Samsung
K4H281638D-TCBO |
| 128 MB |
M470L1714DT0-CB0 |
2.5 |
8 |
8Mx16 |
Samsung
K4H281638D-TCBO |
| 128 MB |
M470L1713DT0-CB0 |
2.5 |
8 |
16MX8 |
Samsung
K4H280828D-TCBO |
| 128 MB |
M470L1624DT0-CB0 |
2.5 |
4 |
16Mx16 |
Samsung
K4H561638D-TCBO |
| 256 MB |
M470L3223DT0-CBO |
2.5 |
8 |
32MX8 |
Samsung
K4H560838D-TCBO |
| 256 MB |
M470L3224BT0-CB0 |
2.5 |
8 |
32MX8 |
Samsung
K4H561638D-TCBO |
| 512 MB |
M470L6423DN0-CB0 |
2.5 |
8 |
64Mx8 |
Samsung
K4H510838D-NCBO |
| 512 MB |
M470L6423CK0-LB0 |
2.5 |
8 |
64Mx8 |
Samsung
K4H510838C-KLB0 |
| Toshiba
|
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 256 MB |
TC59WM807BFT-75 |
2.5 |
8 |
32Mx8 |
Toshiba
TC59WM807BFT-75 |
| Winbond
|
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 128 MB |
W9412FASA-7 |
2 |
8 |
16Mx8 |
Winbond
W942516AH-7 |
| 256 MB |
W9425FASA-75 |
2.5 |
8 |
32Mx8 |
Winbond
W942516AH-75 |
| 
