Memory Compatibility Testing:
The objective of the memory compatibility testing program is to ensure
compliance of different memory modules with the ATI Mobility Radeon™ 9100
IGP chipset. The modules are tested as to ATI specifications
using industry standard testing methods. This testing is
not intended to
replace the normal OEM module qualification process.
The Memory
Compatibility Process describes how modules can be submitted
to ATI approved validation labs. Only modules which pass comprehensive
testing by ATI ’s validation labs are listed here.
Please contact memory@ati.com should
you have any questions.
- Mobility Radeon™ 9100 IGP
Compatible DDR333 (PC2700) 200 Pin SO-DIMM memory Modules
| Buffalo |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 512 MB |
DN333-A512M |
2.5 |
16 |
32M X 16 |
Buffalo
ME46512823MEK |
| Elpida |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 256 MB |
EBD26UC6AKSA-6B |
2.5 |
8 |
16M x 16 |
Elpida
EDD2516AKTA-6B |
| 512 MB |
EBD52UD6ADSA-6B |
2.5 |
16 |
32M x 16 |
Elpida
EDD5116ADTA-6B |
| 1 GB |
EBD11UD8ABDA-6B |
2.5 |
16 |
64M x 8 |
Elpida
EDD5108ABNA-6B |
| 1 GB |
EBD11UD8ADDA-6B |
2.5 |
16 |
64M x 8 |
Elpida
EDD5108ADNA-6B |
| Hynix |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
HYMD216M646A6-J |
2.5 |
4 |
16M x 16 |
Hynix
HY5DU561622AT-J |
| 256 MB |
HYMD232M646C6-J |
2.5 |
8 |
16M X 16 |
Hynix
HY5DU561622CT-J |
| 256 MB |
HYMD232M646A8-J |
2.5 |
8 |
32M X 8 |
Hynix
HY5DU56822AT-J |
| 256 MB |
HYMD532M646A6-J |
2.5 |
8 |
32M X 16 |
Hynix HY5DU121622AT-J |
| 512 MB |
HYMD564M646A6-J |
2.5 |
8 |
32M X 16 |
Hynix
HY5DU121622AT-J |
| 1 GB |
HYMD512M646AFS8-J |
2.5 |
16 |
64M X 8 |
Hynix
HY5DU1G822AFM-J |
| Micron |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
MT4VDDT1664HG-335C2 |
2.5 |
4 |
16M X 16 |
Micron
MT46V16M16-6T |
| 128 MB |
MT4VDDT1664HG-335C3 |
2.5 |
4 |
16M X 16 |
Micron
MT46V16M16-6T |
| 256 MB |
MT8VDDT3264HG-335C2 |
2.5 |
8 |
32M X 8 |
Micron
MT46V32M8-6T |
| 256 MB |
MT8VDDT3264HG-335C3 |
2.5 |
8 |
16M X 16 |
Micron
MT46V16M16-6T |
| 512 MB |
MT8VDDT6464HDG-335C1 |
2.5 |
8 |
32M X 16 |
Micron
MT46V32M16TG-6TC |
| 512 MB |
MT16VDDF6464HG-335C2 |
2.5 |
16 |
32M X 8 |
Micron
MT46V32M8FG-6 |
| 512 MB |
MT8VDDF6464HDG-335C1 |
2.5 |
8 |
32M X 16 |
Micron
MT46V32M16-6T |
| 1 GB |
MT16VDDF12864HG-335C2 |
2.5 |
16 |
64M X 8 |
Micron
MT46V64M8FN-6 |
| Mosel Vitelic |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 256 MB |
V826632G24SATG-C0 |
2.5 |
8 |
32M X 8 |
Mosel Vitelic
V58C2256804SAT6 |
| 512 MB |
V826664G24SASG-C0 |
2.5 |
16 |
32M X 8 |
Mosel Vitelic
V58C2256804SAS6 |
| Nanya |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
NT128D64SH4BBGM-6K |
2.5 |
4 |
16M X 16 |
Nanya
NT5DS16M16BT-6K |
| 256 MB |
NT256D64SH8BAGM-6K |
2.5 |
8 |
16M X 16 |
Nanya
NT5DS16M16BT-6K |
| 512 MB |
NT512D64S8HBAFM-6K |
2.5 |
16 |
32M X 8 |
Nanya
NT5DS32M8BF-6K |
| 512 MB |
NT256D64SH8BAGM-6K |
2.5 |
8 |
16M X 16 |
Nanya NT5DS16M16BT-6K |
| Powerchip Semiconductor |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 256 MB |
AS5D8C44T-6B1T |
2.5 |
8 |
32M X 8 |
Powerchip A2S56D40CTP |
| Qimonda (formerly Infineon) |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
HYS64D16000GDL-6-B |
2.5 |
4 |
16M x 16 |
Qimonda HYB25D256160BT-6 |
| 128 MB |
HYS64D16000GDL-6-C |
2.5 |
4 |
16M x 16 |
Qimonda HYB25D256160CE-6 |
| 128 MB |
HYS64D16000HDL-6-C |
2.5 |
4 |
16M x 16 |
Qimonda HYB25D256160CE-6 |
| 256 MB |
HYS64D32020GDL-6-B |
2.5 |
8 |
16M X 16 |
Qimonda HYB25D256160BT-6 |
| 256 MB |
HYS64D32020HDL-6-C |
2.5 |
8 |
16M X 16 |
Qimonda HYB25D256160CE-6 |
| 256 MB |
HYS64D32020GDL-6-C |
2.5 |
8 |
16M X 16 |
Qimonda HYB25D256160CE-6 |
| 512 MB |
HYS64D64020GBDL-6-B |
2.5 |
16 |
32M X 8 |
Qimonda HYB25D256800BC-6 |
| 512 MB |
HYS64D64020GBDL-6-C |
2.5 |
16 |
32M X 8 |
Qimonda HYB25D256800BC-6 |
| 512 MB |
HYS64D64020HBDL-6-B |
2.5 |
16 |
32M X 8 |
Qimonda HYB25D256800CF-6 |
| 512 MB |
HYS64D64020HBDL-6-C |
2.5 |
16 |
32M X 8 |
Qimonda HYB25D256800CF-6 |
| 512 MB |
HYS64D64020HBDL-6-B |
2.5 |
8 |
32M X 8 |
Qimonda HYB25D51216BE-6 |
| 1 GB |
HYS64D128020GBDL-6-B |
2.5 |
16 |
64M X 8 |
Qimonda HYB25D512800BC-6 |
| Samsung |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 64 MB |
M470L0914DT0-CB3 |
2.5 |
4 |
8M X 16 |
Samsung
K4H281638D-TCB3 |
| 128 MB |
M470L1714DT0-CB3 |
2.5 |
8 |
8M X 16 |
Samsung
K4H281638D-TCB3 |
| 128 MB |
M470L1624DT0-CB3 |
2.5 |
4 |
16M X 16 |
Samsung
K4H561638D-TCB3 |
| 128 MB |
M470L1624FT0-CB3 |
2.5 |
4 |
16M X 16 |
Samsung
K4H561638F-TCB3 |
| 256 MB |
M470L3224DT0-CB3 |
2.5 |
8 |
16M X 16 |
Samsung
K4H561638D-TCB3 |
| 256 MB |
M470L3324BT0-CB3 |
2.5 |
4 |
32M X 16 |
Samsung K4H511638B-TCB3 |
| 256 MB |
M470L3224FT0-CB3 |
2.5 |
8 |
16M X 16 |
Samsung
K4H561638F-TCB3 |
| 512 MB |
M470L6423DN0-CB3 |
2.5 |
16 |
32M X 8 |
Samsung
K4H560838D-NCB3
|
| 512 MB |
M470L6524BT0-CB3 |
2.5 |
8 |
32M X 16 |
Samsung K4H511638B-TCB3
|
| 512 MB |
M470L6423EN0-CB3 |
2.5 |
16 |
32M X 8 |
Samsung
K4H560838E-NCB3
|
| 1 GB |
M470L2923BN0-CB3 |
2.5 |
16 |
64M X 8 |
Samsung
K4H510838B-TCB3
|
| TwinMos Technologies |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 256 MB |
M2G5I08D6ATT5F081AADT |
2.5 |
16 |
32M X 8 |
TwinMos TMD7608F8E60D |
| Viking
Interworks |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 512 MB |
VI4DU646428DBK |
2.5 |
16 |
32M X 8 |
Samsung
K4H560838D-NCB3
|
| 1 GB |
VI4DU286428EBK |
2.5 |
16 |
64M X 8 |
Micron MT46V64M8FN-5B
|
Compatible DDR400 (PC3200) 200 Pin SO-DIMM memory Modules
| Hynix |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
HYMD216M646C6-D43 |
3 |
4 |
16M X 16 |
Hynix
HY5DU561622CT-D43 |
| 256 MB |
HYMD564M646A6-D43 |
3 |
4 |
32M X 16 |
Hynix HY5DU121622AT-D43 |
| 256 MB |
HYMD232M646A6-D43 |
3 |
8 |
16M X 16 |
Hynix
HY5DU561622AT-D4 |
| 256 MB |
HYMD232M646C6-D43 |
3 |
8 |
16M X 16 |
Hynix
HY5DU561622CT-D43 |
| 512 MB |
HYMD532M646A6-D43 |
3 |
8 |
32M X 16 |
Hynix HY5DU121622AT-D43 |
| Kingston
Technology |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
KVR400X64SC3A/128 |
3 |
4 |
16M X 16 |
Micron
MT46V16M16TG-5B |
| Micron |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
MT8VDDT166HG-403B2 |
3 |
8 |
16M x 8 |
Micon MT46V16M8 |
| 128 MB |
MT4VDDT1664HG-40BC3 |
3 |
4 |
16M x 16 |
Micon MT46V16M16 |
| 256 MB |
MT8VDDT3264HDG-40BC3 |
3 |
8 |
16M x 16 |
Micron MT46V16M16 |
| 512 MB |
MT8VDDT6464HDG-40BC1 |
3 |
8 |
32M x 16 |
Micron MT46V32M16TG-5BC |
| Nanya |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 256 MB |
NT256D64SH8BAGM-5T |
3 |
8 |
16M X 16 |
Nanya
NT5DS16M16BT-5T |
| Qimonda (formerly Infineon) |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 256 MB |
HYS64D32020GDL-5-B |
3 |
8 |
16M X 16 |
Qimonda HYB25D256160BT-5 |
| 512 MB |
HYS64D64020GBDL-5-B |
3 |
16 |
32M X 8 |
Qimonda HYB25D256800BC-5 |
| 512 MB |
HYS64D64020HBDL-6-C |
2.5 |
8 |
32M X 8 |
Qimonda HYB25D51216BE-6 |
| Samsung |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 128 MB |
M470L1624DT0-CCC |
3 |
4 |
16M X 16 |
Samsung
K4H561638D-TCCC |
| 128 MB |
M470L1624FT0-CCC |
3 |
4 |
16M X 16 |
Samsung
K4H561638F-TCCC |
| 256 MB |
M470L3223DT0-CC4 |
3 |
8 |
32M X 8 |
Samsung
K4H560838D-TCC4 |
| 256 MB |
M470L3224FT0-CCC |
3 |
8 |
16M X 16 |
Samsung
K4H561638F-TCCC |
| 512 MB |
M470L6423EN0-CCC |
3 |
16 |
32M X 8 |
Samsung
K4H560838E-NCCC
|
| 1 GB |
M470L2923BN0-CCC |
3 |
16 |
64M X 8 |
Samsung
K4H510838B- TCCC |
| Viking
Interworks |
| Density |
Module Part Number |
CL |
Loads |
Type |
Component Part Number |
| 512 MB |
VI4DU646428DBP |
3 |
16 |
32M X 8 |
Samsung K4H560838E-GCCC
|
| 1 GB |
VI4DU286428EBP |
3 |
16 |
64M X 8 |
Micron MT46V64M8FN-5B
|
| 
